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Kioxia THGAM e-MMC™ NAND Flash Memory

KIOXIA THGAM e-MMC™ NAND Flash Memory implements Bit Column Stacked (BiCS) FLASH™ 3D technology. These flash memories offer the optimal solution for applications where higher data volumes need to be stored in a cost-efficient way. The THGAM eMMC flash memory is fully compliant with the Multimedia Card Association (MMCA) high-speed memory interface standard. These flash memories conform to the latest JEDEC version 5.1.

The THGAM eMMC flash memory features integrated memory management with error correction code, bad block management, wear-leveling, and garbage collection. These flash memories come in an FBGA package and a standard (-25°C to +85°C) temperature version. Typical applications include consumer electronics, multimedia, smart metering, and intelligent lighting.

Features

  • 16GB to 128GB memory
  • BiCS 3D NAND technology
  • Multi-Level Cell (MLC) technology
  • Conforms to the latest JEDEC version 5.1
  • Integrated memory management:
    • Error correction code
    • Bad block management
    • Wear-leveling
    • Garbage collection
  • Higher interface speed HS400 in accordance with JEDEC 5.1
  • Managed memory
  • Utilizes high-quality Toshiba MLC NAND flash memory in combination with a Toshiba-origin developed controller
  • -25°C to +85°C operating temperature range (standard)
  • FBGA package

Applications

  • Industrial
  • Consumer electronics
  • Multimedia
  • Smart metering
  • Intelligent lighting
  • Smart applications

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Kioxia THGBM e-MMC™ Managed NAND Flash Memory

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Published: 2019-04-24 | Updated: 2025-06-13