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Molex Slim-Grid 1.27mm Pitch Board-to-Board Connectors

Molex Slim-Grid 1.27mm Pitch Board-to-Board Connectors offer a high-current density board-to-board interconnect solution in a 1.27mm x 1.27mm grid pattern. These connectors provide a 125VAC rating, 4.3A current per circuit, and 30mΩ contact resistance in a -55°C to +105°C temperature range. Slim-Grid offers design flexibility and high current density per inch for various data, automotive, industrial, and consumer applications. This Molex connector series provides a single-sided polarization slot that prevents wrong orientation and mismating. This single-sided polarization feature also improves mating for smaller circuit sizes of six and below. Locking windows (headers) and locking ramps (receptacles) ensure robust connector retention when mated. The locating pegs ensure precise connector positioning on the printed circuit board (PCB).

Features

  • Based on a 1.27mm x 1.27mm grid pattern
  • Single-sided polarization slot
    • Prevents wrong orientation and mismating
    • Improves mating for smaller circuit sizes of six and below
  • Locking window and locking ramp ensure robust connector retention when mated
  • Locating pegs (shrouded right-angle header, through-hole) ensure precise connector positioning on PCB
  • Halogen free and RoHS compliant

Applications

  • Consumer/smart home
    • Energy-efficient appliances
    • Home theaters
    • White goods
    • Drones
  • Automotive
    • Car audio
    • Navigation systems
  • Telecommunications/networking
    • Hubs
    • Servers
    • Routers
    • Switches
  • Mobile
    • Smartphones
    • Portable electronic devices

Specifications

  • 1.27mm pitch
  • 4 to 80 circuits
  • 125VAC maximum voltage
  • 4.3A maximum current (per circuit)
  • 30mΩ contact resistance
  • 1000MΩ insulation resistance
  • Terminal retention force
    • 2.22N in housing
    • 4N for header
  • 50 cycles minimum durability
  • Force ranges
    • 10N (4-circuit) to 15N (24-circuit) mating
    • 0.5N (4-circuit) to 3N (24-circuit) unmating
  • UL 94V-0, black LCP housing
  • Copper alloy contacts
  • Plating
    • 0.05µ, 0.38µ, and 0.76µ gold (Au) in the contact area
    • 2.00µ matte tin (Sn) in the solder tail area
    • 1.27µ nickel (Ni) underplating
  • -55°C to +105°C operating temperature range

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Published: 2017-04-17 | Updated: 2024-07-29