Infineon Technologies KIT_IM68D128BV01_FLEX Evaluation Kit

Infineon Technologies KIT_IM68D128BV01_FLEX Evaluation Kit is an evaluation system designed for IM68D128BV01, an ultra-low power digital XENSIV™ MEMS microphones. Due to its small size and flexibility, this kit directs the placement of the flex board into a prototype. The KIT_IM68D128BV01_FLEX kit consists of five flex boards and one adapter board. The digital flex board is equipped with a digital PDM output microphone and a 0.1µF supply bypass capacitor. The adapter board consists of a 6-position ZIF and a 2.54mm board-to-board connector. The KIT_IM68D128BV01_FLEX kit is ideal for Active Noise Cancellation (ANC) headphones and earbuds, smartphones, laptops/tablets, conference systems, cameras, camcorders, smart speakers, home automation, and IoT devices.

Features

IM68D128BV01:
- 580µA low current consumption in normal mode
- 190µA ultra-low current consumption in low power mode
- Signal-to-noise ratio (SNR) of 67.5dB(A)
- Acoustic overload point at 128dBSPL
- 20Hz flat frequency response with low frequency roll-off
- Component-level IP57 dust and water resistant
- 3.5mm x 2.65mm x 0.98mm package dimensions
- Enhanced RF shielding
- Digital PDM output
- Bottom port

Quick connection to the evaluation system
25mm x 4.5mm Small size
Pre-soldered MEMS microphone

Applications

Active Noise Cancellation (ANC) headphones and earbuds
Smartphones and mobile devices
High-quality audio capturing:
- Laptops and tablets
- Conference systems
- Cameras, camcorders, and camera accessories