Molex NeoScale High-Speed Mezzanine System
Molex NeoScale High-Speed Mezzanine System delivers clean signal integrity at 56Gbps. This system features a high-speed triad wafer design with patented Solder-Charge Technology for customized PCB routing in high-density system applications. Ideal for small footprint designs with limited PCB real estate, the modular NeoScale mezzanine system offers a durable and easily customizable design tool for high-density system applications. Each Molex NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, users can mix and match components to build a mezzanine solution to meet application requirements for signals supporting high-speed differential pairs (85Ω and 100Ω), high-speed single-ended transmissions, low-speed single-ended signals, and power contacts.
Features
- Modular triad wafer design
- Four triad configurations
- High-speed differential pairs (85Ω and 100Ω impedance)
- High-speed single-ended traces
- Low-speed single-ended lines
- Power contacts
- Honeycomb construction housing design isolates each differential pair
- High-speed triad wafers have 3 pins per differential pair (2 signal pins and 1 shielded ground pin)
- 82 differential pairs per square inch
- Mirror-image triad layout
- Enables the PCB routing in 1 or 2 layers for 4- and 6-row housings, respectively
- Provides ease in PCB routing
- Lowers overall system costs by decreasing the number of PCB layers required for signal routing
- Tombstone structures in receptacle housing prevent terminal damage
- Patented Solder-Charge Technology (SMT attach method) provides reliable, robust solder joints
- Options
- 12mm to 42mm stack heights
- Circuit sizes of 24 to 120 triad wafers
- 4 or 6 rows
- 85Ω or 100Ω impedance
- Reliable mating interface with 2mm conductive wipe for clean signal transmission and enhanced performance
- Durable housing material
- Plug assembly features 1 differential pair with 2.80mm pitch
- Receptacle assembly housing includes polarization and keying features
- Ground pin has 2 SMT attachment points, with 4 solder charge joints per triad wafer
- Pug and receptacle orientation provides mirrored configuration with dividing line of back-to-back shields, the resulting mirror line bisects triad pair to facilitate PCB routing and RX/TX pin-out management
- Halogen free and RoHS compliant
Applications
- Telecommunication
- Hubs
- Servers
- Switches
- Industrial controllers
- Personality cards
- Networking
- NAS towers
- Rackmount servers
- MedTech
- High data-rate scanning
Specifications
- Electrical
- 30VAC(rms) maximum voltage
- 8.0A maximum current in power triads
- 10mΩ maximum contact resistance
- 200VAC(rms) dielectric withstanding voltage
- 1000MΩ minimum insulation resistance
- Mechanical
- 1N contact retention to housing
- 0.75N maximum mating force
- 0.25N minimum unmating force
- 100 cycle minimum durability
- -55°C to +85°C operating temperature range
- Materials
- High-temperature LCP housing
- Copper (Cu) contact
- Plating
- 30µ" in the contact area
- 15µ" in the solder tail area
- 45µ" nickel (Ni) underplating
Videos
Application Briefs
- NeoScale High-Speed Mezzanine System Maximizes Data Rates
- NeoScale 56Gbps High-Speed Mezzanine System Delivers Tall Stack of Benefits
- Bring Together Personality Cards and Main Boards for Advanced Computing in Shrinking Boxes
- Bring Together Programmable Controllers and Main Boards for Advanced Computing in Automotive Applications
Additional Resources
Related Connectors
Molex Board-to-Board Connectors
Variety of configurations for microminiature, high-speed, high-density, & high-power applications.
Published: 2015-09-14
| Updated: 2025-03-26