Mitsubishi Electric SLIMDIP™ Modules

Mitsubishi Electric SLIMDIP™ Modules are offered in an ultra-small, compact, transfer mold package that contributes to downsizing and weight reduction of inverter systems for home appliances. The SLIMDIP series integrates a reverse conducting IGBT (RC-IGBT) that applies the 7th-generation technology as a power chip. With integrated power chips, drive, and protection circuits, the SLIMDIP devices are ideal for AC 100V-240V class low-power motor inverter control. Mitsubishi Electric SLIMDIP Modules feature a transfer-molded structure that incorporates a high thermal conductivity insulation sheet, providing heat. The SLIMDIP lineup includes the SLIMDIP-L and SLIMDIP-S.

Features

  • 30% smaller package size compared to Super Mini DIPIPM
  • RC-IGBT thin wafer structure
  • Optimized terminal arrangement
  • Built-in control IC with protection functions
  • Bootstrap diodes (BSDs) with current limiting resistor
  • Fail-safe overtemperature protection
  • Normal and short terminals

Applications

  • Home appliances
    • Refrigerators
    • Air conditioners
    • Washing machines
  • AC 100V to 240V (DC voltage: 400V or below) 3-phase low-power motor inverter drivers

Specifications

  • +115°C maximum case temperature
  • 450V supply voltage
  • 600V collector-emitter voltage
  • 20V control supply voltage
  • High active input of 3V to 5V
  • 2000Vrms insulation voltage
  • Open emitter pin of N-side
  • Insulation sheet structure
  • RoHS compliant

Internal Cross-section Structure

Infographic - Mitsubishi Electric SLIMDIP™ Modules

SLIMDIP Wiring Example

Mechanical Drawing - Mitsubishi Electric SLIMDIP™ Modules

Internal Circuit

Application Circuit Diagram - Mitsubishi Electric SLIMDIP™ Modules
Published: 2020-08-21 | Updated: 2024-10-29