Mitsubishi Electric SLIMDIP™ Modules
Mitsubishi Electric SLIMDIP™ Modules are offered in an ultra-small, compact, transfer mold package that contributes to downsizing and weight reduction of inverter systems for home appliances. The SLIMDIP series integrates a reverse conducting IGBT (RC-IGBT) that applies the 7th-generation technology as a power chip. With integrated power chips, drive, and protection circuits, the SLIMDIP devices are ideal for AC 100V-240V class low-power motor inverter control. Mitsubishi Electric SLIMDIP Modules feature a transfer-molded structure that incorporates a high thermal conductivity insulation sheet, providing heat. The SLIMDIP lineup includes the SLIMDIP-L and SLIMDIP-S.Features
- 30% smaller package size compared to Super Mini DIPIPM
- RC-IGBT thin wafer structure
- Optimized terminal arrangement
- Built-in control IC with protection functions
- Bootstrap diodes (BSDs) with current limiting resistor
- Fail-safe overtemperature protection
- Normal and short terminals
Applications
- Home appliances
- Refrigerators
- Air conditioners
- Washing machines
- AC 100V to 240V (DC voltage: 400V or below) 3-phase low-power motor inverter drivers
Specifications
- +115°C maximum case temperature
- 450V supply voltage
- 600V collector-emitter voltage
- 20V control supply voltage
- High active input of 3V to 5V
- 2000Vrms insulation voltage
- Open emitter pin of N-side
- Insulation sheet structure
- RoHS compliant
Internal Cross-section Structure
SLIMDIP Wiring Example
Internal Circuit
Published: 2020-08-21
| Updated: 2024-10-29
