ARM Cortex-M33 Coeur Modules multiprotocoles

Résultats: 34
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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Conditionnement
Silex Technology Modules multiprotocoles IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
Fiche technique
Délai de livraison produit non stocké 34 Semaines
Min. : 1
Mult. : 1

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Modules multiprotocoles the option to attach an antenna via a trace. does not include the u.Fl connector
Fiche technique
Délai de livraison produit non stocké 34 Semaines
Min. : 500
Mult. : 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Modules multiprotocoles the option to attach an antenna via a trace does not include the u.Fl connector
Fiche technique
Délai de livraison produit non stocké 34 Semaines
Min. : 1
Mult. : 1

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Quectel Modules multiprotocoles Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
Fiche technique
Délai de livraison produit non stocké 16 Semaines
Min. : 500
Mult. : 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Modules multiprotocoles Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Fiche technique
Délai de livraison produit non stocké 16 Semaines
Min. : 500
Mult. : 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Modules multiprotocoles Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Fiche technique
Délai de livraison produit non stocké 16 Semaines
Min. : 1,000
Mult. : 1,000
: 1,000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Modules multiprotocoles Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Fiche technique
Délai de livraison produit non stocké 16 Semaines
Min. : 1,000
Mult. : 1,000
: 1,000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Modules multiprotocoles Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Fiche technique
Délai de livraison produit non stocké 18 Semaines
Min. : 500
Mult. : 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C RF Connector 25.5 mm x 18 mm x 3.16 mm 802.11a/b/g/n/ac/ax Reel
Quectel Modules multiprotocoles Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Fiche technique
Délai de livraison produit non stocké 18 Semaines
Min. : 500
Mult. : 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel