IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors are designed for next-generation COM-HPC embedded computing. These advanced mezzanine connectors offer stacking heights of 5mm and 10mm with an open pin field, providing designers with layout flexibility. A BGA pin-in-ball structure enhances mounting reliability, making the Hirose IT18 series ideal for embedded computing, servers, industrial automation, and medical imaging systems where space-saving, high-speed connectivity is critical.

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Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Pitch
Termination Style
Mounting Angle
Current Rating
Voltage Rating
Minimum Operating Temperature
Maximum Operating Temperature
Contact Plating
Contact Material
Housing Material
Series
Packaging
Hirose Connector Board to Board & Mezzanine Connectors IT18 400P 112Gpbs BGA 1.2a Recept
Datasheet
500Expected 2026-09-15
Min.: 1
Mult.: 1
: 500

Connector 400 Position 0.635 mm (0.025 in) Solder Vertical 1.2 A 150VAC - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) IT18 Reel, Cut Tape
Hirose Connector Board to Board & Mezzanine Connectors IT18 400P 112Gpbs BGA 1.2a 10.0mm Plug
Datasheet
150Expected 2026-11-03
Min.: 1
Mult.: 1
: 150

Connector 400 Position 0.635 mm (0.025 in) Solder Vertical 1.2 A 150VAC - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) IT18 Reel, Cut Tape
Hirose Connector Board to Board & Mezzanine Connectors IT18 400P 112Gpbs BGA 1.2a 5.0mm Plug
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 425
Mult.: 425
: 425

Connector 400 Position 0.635 mm (0.025 in) Solder Vertical 1.2 A 150VAC - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) IT18 Reel