+ 85 C Multiprotocol Modules

Results: 619
Select Image Part # Mfr. Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
u-blox Multiprotocol Modules IW416, 802.11abgn+BT, 2 U.FL connectors 9,857In Stock
Min.: 1
Mult.: 1
: 500

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCM, SDIO, UART 3 V 3.6 V - 40 C + 85 C u.FL 10.4 mm x 14.3 mm x 2.5 mm Bluetooth 5.2 802.11 a/b/g/n Reel, Cut Tape
Microchip Technology Multiprotocol Modules ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2,220In Stock
Min.: 1
Mult.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Advantech Multiprotocol Modules 802.11ax+BT5.3, NXP 88W9098, PCIe-UART, 215In Stock
Min.: 1
Mult.: 1
AIW-165 2.4 GHz, 5 GHz UART 3.3 V 3.3 V - 40 C + 85 C Without Antenna 28 mm x 30 mm x 3.95 mm Bluetooth 5.3
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE 213In Stock
Min.: 1
Mult.: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Ezurio Multiprotocol Modules Sterling LWB+, MHF4, Cut Tape 200In Stock
Min.: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Ezurio Multiprotocol Modules BL654 - Bluetooth v5 / 802.15.4 / NFC Module (Nordic nRF52840) Integrated Antenna - Cut tape 144In Stock
500Expected 2026-09-01
Min.: 1
Mult.: 1

BL654 2.4 GHz 8 dBm GPIO, I2C, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C PCB 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Espressif Systems Multiprotocol Modules ESP32-WROVER-E integrates ESP32-D0WD-V3, with higher stability and safety performance. 70In Stock
2,600Expected 2026-10-26
Min.: 1
Mult.: 1

ESP32-WROVER-E 2.4 GHz 20 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 31.4 mm x 3.3 mm Bluetooth 4.2
u-blox Multiprotocol Modules ESP32, 802.11bgn+BT, 8 MB flash, PCB ant., open CPU 819In Stock
2,000Expected 2026-12-10
Min.: 1
Mult.: 1
: 500

NINA-W10 2.4 GHz 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n Reel, Cut Tape
Silex Technology Multiprotocol Modules [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 7In Stock
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Ezurio Multiprotocol Modules Module, Sterling LWB5+, M.2, Key E, SDIO, UART 188In Stock
Min.: 1
Mult.: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Ezurio Multiprotocol Modules 60 Series, Sterling Module w/u.FL, PCIE/UART 195In Stock
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna 500In Stock
Min.: 1
Mult.: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Ezurio Multiprotocol Modules Sterling LWB+, Chip Antenna, CutTape 1,152In Stock
Min.: 1
Mult.: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Espressif Systems Multiprotocol Modules SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector. 565In Stock
650Expected 2026-10-26
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Ezurio Multiprotocol Modules Module, Sterling LWB5+, Chip Antenna 612In Stock
Min.: 1
Mult.: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 5In Stock
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Espressif Systems Multiprotocol Modules SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector, -40C - +105C 3,204In Stock
Min.: 1
Mult.: 1
: 6,500
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Reel, Cut Tape
Embedded Artists Multiprotocol Modules 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51In Stock
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Espressif Systems Multiprotocol Modules SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1,008In Stock
Min.: 1
Mult.: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Microchip Technology Multiprotocol Modules ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 809In Stock
Min.: 1
Mult.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Texas Instruments Multiprotocol Modules WL18xxMOD Dual-Band Ind Mod A 595-WL1807 A 595-WL1807MODGIMOCR 218In Stock
Min.: 1
Mult.: 1
: 250

WL1807MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Silex Technology Multiprotocol Modules [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15In Stock
Min.: 1
Mult.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Silex Technology Multiprotocol Modules [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10In Stock
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
AcSiP Multiprotocol Modules AI7931LD - Multiprotocol Modules WIFI6 Dual Band 2.4/5GHz M33 SoC Module 122In Stock
Min.: 1
Mult.: 1

WIFI 300 MHz ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART 2.97 V 3.63 V - 40 C + 85 C 32 mm x 32 mm x 2.7 mm Bluetooth 5.0 802.11 a/b/g/n/ac/ax Bag
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP 200In Stock
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi