ETUO-B04-25-300-0-1-1-4-02

Samtec
200-ETUOB42530001142
ETUO-B04-25-300-0-1-1-4-02

Mfr.:

Description:
Fiber Optic Cable Assemblies FireFly Extended Temperature Active Optical Micro Flyover Cable Assembly

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Learn more about Samtec ETUO-B04-25-300-0-1-1-4-02

In Stock: 1

Stock:
1 Can Ship Immediately
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Ext. Price:
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Pricing (CAD)

Qty. Unit Price
Ext. Price
$4,402.01 $4,402.01
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Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Fiber Optic Cable Assemblies
RoHS:  
REACH - SVHC:
ETUO
MTP
300 cm
Tray
Black
Brand: Samtec
Data Transmission Rate: 25 Gbp/s
Product Type: Fiber Optic Cable Assemblies
Subcategory: Fiber Optic
Tradename: FireFly
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Attributes selected: 0

Datasheet

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Specification Sheets

CAHTS:
8544700000
USHTS:
8544700000
KRHTS:
8544700000
MXHTS:
8544700100
ECCN:
EAR99

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

FireFly™ Mid-Board Optical Transceiver Solutions

Samtec offers mid-board optical transceiver solutions. This growing and comprehensive family of products delivers reliable signal integrity over an extended distance in chip-to-chip, board-to-board, system-to-system, and onboard connectivity. The designs take data connection "off the board" for up to 28Gbps per lane, with a path to 112Gbps PAM4 via optical cable at greater distances or copper for cost optimization. FireFly™ Micro Flyover System™ is an interconnect system that enables designers to use micro-footprint high-performance optical and cost-effective copper interconnects interchangeably with the same connector system.

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