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SMD2088-6000

Name: Chip Quik SMD2088-6000
Brand: Chip Quik
SKU: 910-SMD2088-6000
Price: 115.11 CAD
Availability: InStock

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Mouser #:

910-SMD2088-6000

Mfr. #:

SMD2088-6000

Mfr.:

Chip Quik

Description:

Solder Solder Spheres Sn96.5/Ag3.0/Cu0.5 .044" (1.1mm) diameter 6K Bottle (SAC305 lead-free solder balls)

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

SMD2088-6000 Datasheet (PDF)

More Information

Learn more about Chip Quik SMD2088-6000

In Stock: 7

Stock:: 7 Can Ship Immediately

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Factory Lead-Time:: 4 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$115.11	$115.11

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Chip Quik
Product Category:	Solder
RoHS:
Product:	Solder Spheres
Type:	Lead Free
Alloy:	Sn96.5/Ag3.0/Cu0.5
Diameter:	1.1 mm
Contains Lead:	No
Brand:	Chip Quik
Product Type:	Solder
Factory Pack Quantity:	1
Subcategory:	Solder & Equipment

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Datasheet

SMD2088-6000 Datasheet (PDF)

Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.

SMD2088-6000 BGA Solder Spheres

Chip Quik SMD2088-6000 BGA Solder Spheres are large-sized lead-free spheres for larger soldering projects. These Chip Quick BGA solder spheres feature a 1.1mm diameter and come in 6000 spheres per bottle. SMD2088-6000 spheres are made from a Sn96.5/Ag3.0/Cu0.5 alloy and feature a +217°C to +220°C melting point. These solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. The spheres also exceed IPC and MIL standards for purity levels and size tolerances.