ROHS Sensor Interface

Results: 711
Select Image Part # Mfr. Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Interface Type Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package / Case ESD Protection Qualification Packaging
Renesas Electronics ZSC31050FIB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas / Intersil ZSSC3170FE1B
Renesas / Intersil Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,300
Mult.: 2,300

Automotive 1-Wire, I2C, LIN, PWM 18 V 7 V - 40 C + 150 C SMD/SMT Wafer Wafer Pack
Renesas Electronics ZSC31014EIC
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 8,500
Mult.: 8,500

Sensor Signal Conditioner SMD/SMT Die Tray
Renesas Electronics ZSC31050FAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4169DE5T
Renesas Electronics Sensor Interface TSSOP / 16 / 5X4MM-0 Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Tube
Infineon Technologies TLE5046MTICPW2100HALA1
Infineon Technologies Sensor Interface SPEED SENS Non-Stocked Lead-Time 18 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

Ammo Pack
Renesas Electronics ZSSC3123AI6B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 9,464
Mult.: 9,464

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 24 Weeks
Min.: 4,347
Mult.: 4,347

Sensor Signal Conditioner I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI1B
Renesas Electronics Sensor Interface WAFER UNSAWN, 304 Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3123AI1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Tray
Renesas Electronics ZSSC3138BE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,880
Mult.: 2,880

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3154BE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3218BI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 17,000
Mult.: 17,000

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3123AI6C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 9,464
Mult.: 9,464

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Tray
Renesas Electronics ZSSC3215CI1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 12,000
Mult.: 12,000

SMD/SMT Die Tray
Renesas Electronics ZSSC4151CE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,347
Mult.: 4,347

SMD/SMT Die Tray
Renesas Electronics ZSSC4161DE1C
Renesas Electronics Sensor Interface SAWN WAFER ON WAFER FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Tray
Renesas Electronics ZSSC3018BA2C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 16,000
Mult.: 16,000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Tray
Renesas Electronics ZSSC3123AI3B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3170EA1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2,300
Mult.: 2,300

Sensor Signal Conditioner 1-Wire, I2C, LIN, PWM 18 V 7 V - 40 C + 125 C SMD/SMT Wafer
Infineon Technologies TLE5045MTIC100HALA1
Infineon Technologies Sensor Interface SPEED SENS Non-Stocked Lead-Time 18 Weeks
Min.: 2,000
Mult.: 2,000
: 2,000

Ammo Pack
Infineon Technologies TLE50452IC50XTMA1
Infineon Technologies Sensor Interface SPEED SENS Non-Stocked Lead-Time 18 Weeks
Min.: 3,600
Mult.: 3,600
: 3,600

Reel