Dynamic Random Access Memory (DRAM)

Intelligent Memory Dynamic Random Access Memory (DRAM) includes a full range of JEDEC-compliant DRAMs and ECC DRAMs (SDRAM, DDR, DDR2, DDR3, DDR4, LPDDR4). From an application's point of view, these components work like a monolithic device. The DRAM devices allow for maximum levels of memory density without altering existing board layouts or designs.

Types of Memory ICs
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Results: 55
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Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Mounting Style
Package / Case
Memory Size
Organization
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Intelligent Memory DRAM DDR2 2Gb, 1.8V, 512Mx4, 400MHz (800Mbps), 0C to +95C, FBGA-60
Datasheet
Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-60 2 Gbit 512 M x 4 0 C + 95 C Tray
Intelligent Memory DRAM DDR2 2Gb, 1.8V, 256Mx8, 400MHz (800Mbps), -40C to +95C, FBGA-60
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-60 2 Gbit 256 M x 8 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC DDR3, 1Gb, 1.5V, 128Mx8, 667MHz (1333Mbps), -40C to +95C, FBGA-78
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-78 1 Gbit 128 M x 8 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC LPDDR4, 4Gb, 1.1V, 128Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Tray
Intelligent Memory DRAM ECC LPDDR4, 8Gb, 1.1V, 256Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 8 Gbit 256 M x 32 - 40 C + 95 C Tray