AP510NFA-CBR

Ambiq
222-AP510NFA-CBR
AP510NFA-CBR

Mfr.:

Description:
ARM Microcontrollers - MCU Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, -20 to +70 C, 225-pin BGA

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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More Information
Learn more about Ambiq AP510NFA-CBR

In Stock: 3,883

Stock:
3,883 Can Ship Immediately
Factory Lead-Time:
22 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (CAD)

Qty. Unit Price
Ext. Price
$15.51 $15.51
Full Reel (Order in multiples of 4000)
$15.51 $62,040.00

Product Attribute Attribute Value Select Attribute
Ambiq
Product Category: ARM Microcontrollers - MCU
RoHS:  
Apollo 510
SMD/SMT
BGA-183
ARM Cortex M55
32 bit
12 bit
250 MHz
3.75 MB
1.71 V
3.63 V
- 20 C
+ 70 C
Reel
Cut Tape
Brand: Ambiq
Data ROM Size: 4 MB
Interface Type: Audio, I2C, MIPI-DSI, SPI, UART, USB 2.0
Moisture Sensitive: Yes
Number of ADC Channels: 11 Channel
Operating Supply Voltage: 1.71 V to 3.63 V
Product Type: ARM Microcontrollers - MCU
Program Memory Type: Cache
Factory Pack Quantity: 4000
Subcategory: Microcontrollers - MCU
Watchdog Timers: Watchdog Timer
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Attributes selected: 0

Datasheet

Compliance Codes
CAHTS:
8542310000
CNHTS:
8542319092
USHTS:
8542310070
TARIC:
8542319000
ECCN:
5A992.C
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Apollo510 Advanced AI on a Chip

Ambiq Apollo510 Advanced AI on a Chip significantly upgrades hardware and software, using an AI-focused Arm® Cortex®-M55 CPU with Helium technology. The Ambiq Apollo510 delivers processing speeds up to 250MHz and offers 16x better latency and over 2x power efficiency compared to its predecessor, the Apollo4. This makes it ideal for deploying advanced AI models in speech, vision, health, and industrial applications on battery-powered devices. The device is available in BGA and CSP package options. 

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