Tray Multiprotocol Modules

Results: 156
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Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
u-blox Multiprotocol Modules M.2 card with JODY-W377, single package
Datasheet
23Expected 2026-07-23
Min.: 1
Mult.: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Microchip Technology Multiprotocol Modules Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Datasheet
144Expected 2026-07-24
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors Multiprotocol Modules IW610BHN/A1ZDI
Datasheet
25Expected 2026-08-21
Min.: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW610CHN/A1ZDI
Datasheet
25Expected 2026-08-21
Min.: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
Quectel Multiprotocol Modules Cat 4 + 3G, 1Gbit ROM+1Gbit RAM, data only application, North America, mPCIe form factor
Datasheet
100On Order
Min.: 1
Mult.: 1

824 MHz to 960 MHz, 1.71 GHz to 2.17 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
Datasheet
99Expected 2026-08-06
Min.: 1
Mult.: 1

Tray
Insight SiP Multiprotocol Modules WiFi 6/BLE module based on NXP RW612 chip (in tray)
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 100
Mult.: 100

Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Lead-Time 8 Weeks
Min.: 1
Mult.: 1

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Ezurio Multiprotocol Modules 60 Series, Summit Module w/u.FL, USB/USB, (NXP Cortex A5, 88W8997)
Datasheet
Non-Stocked
Min.: 100
Mult.: 100

60-2230C Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/CIC/CE
Datasheet
Non-Stocked
Min.: 196
Mult.: 196

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. U.FL for External Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Datasheet
Non-Stocked
Min.: 196
Mult.: 196

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C u.FL 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotocol Modules 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with Chip Antenna. Certified FCC/IC/CE
Datasheet
Non-Stocked
Min.: 980
Mult.: 196

2.4 GHz 17 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 14.5 mm x 34 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Inventek Multiprotocol Modules 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with U.FL. Certified FCC/IC/CE
Datasheet
Non-Stocked
Min.: 980
Mult.: 196

BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems Multiprotocol Modules SMD module, ESP32-PICO-V3-02 with 8 MB flash and 2 MB PSRAM die inside, ESP32 ECO V3, IPEX antenna
Datasheet
Non-Stocked Lead-Time 14 Weeks
Min.: 6,500
Mult.: 6,500
Tray
Insight SiP Multiprotocol Modules ISP3010-UX nRF52832 BLE 5 Module
Datasheet
Non-Stocked
Min.: 50
Mult.: 50
2.4 GHz 4 dBm SPI 1.8 V 6 V - 30 C + 85 C Built-In 14 mm x 14 mm x 1.5 mm Bluetooth 5.0 Tray
u-blox Multiprotocol Modules M.2 card with JODY-W377, in tray, SDIO interface
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1

2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
u-blox Multiprotocol Modules M.2 card with MAYA-W271, in tray Non-Stocked Lead-Time 18 Weeks
Min.: 140
Mult.: 140

2.4 GHz, 5 GHz GPIO, SPI, UART u.FL 22 mm x 30 mm x 2.8 mm 802.11 a/b/g/n/ac/ax Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module, Chip Antenna
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Microchip Technology Multiprotocol Modules Wi-Fi + Bluetooth LE Module,u.FL Antenna
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

2.412 GHz to 2.484 GHz 18.3 dBm SPI 2.7 V 3.6 V - 40 C + 85 C 22.4 mm x 14.7 mm x 2 mm Bluetooth Tray
Silicon Labs Multiprotocol Modules Silicon Laboratories Non-Stocked
Min.: 105
Mult.: 105

AMW004 2.412 GHz to 2.484 GHz 19 dBm I2C, SPI, UART 1.62 V 3.6 V - 30 C + 85 C 17.8 mm x 31.8 mm x 3.1 mm BLE 802.11 b/d/e/g/h/i/j/n Tray
Silicon Labs Multiprotocol Modules MGM13S02F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1,885
Mult.: 1,885

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GA Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connec
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1,885
Mult.: 1,885

MGM13S 2.4 GHz 19 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Built-In 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Tray
Silicon Labs Multiprotocol Modules MGM13S12F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1,885
Mult.: 1,885

MGM13S 2.4 GHz I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C 6.5 mm x 6.5 mm x 1.4 mm Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules Non-Stocked
Min.: 420
Mult.: 420
2.402 GHz to 2.48 GHz 20 dBm 1.85 V 3.6 V - 40 C + 85 C Tray
Silicon Labs Multiprotocol Modules 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules Non-Stocked
Min.: 350
Mult.: 350
2.402 GHz to 2.48 GHz 20 dBm 1.85 V 3.6 V - 40 C + 85 C Tray