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CYBT-263065-02

Name: Infineon CYBT-263065-02
Brand: Infineon Technologies
SKU: 727-CYBT-263065-02
Price: 22.85 CAD
Availability: InStock

Mouser #:

727-CYBT-263065-02

Mfr. #:

CYBT-263065-02

Mfr.:

Infineon Technologies

Description:

Bluetooth Modules - 802.15.1 BT DM INDUSTRIAL AND IOT

Datasheet:

CYBT-263065-02 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Infineon Technologies CYBT-263065-02

In Stock: 190

Stock:: 190

Can Ship Immediately

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On Order:: 500

Expected 2026-11-26
Factory Lead-Time:: 29

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$22.85	$22.85
	$20.25	$202.50
	$18.86	$471.50
	$17.45	$1,745.00
	$16.60	$4,150.00
Full Reel (Order in multiples of 500)
	$16.08	$8,040.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Bluetooth Modules - 802.15.1
RoHS:
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Infineon Technologies
Moisture Sensitive:	Yes
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth LE, Classic Bluetooth
Factory Pack Quantity:	500
Subcategory:	Wireless & RF Modules

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Datasheet

CYBT-263065-02 Datasheet (PDF)

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Compliance Codes

USHTS:: 8517620090
JPHTS:: 851762090
TARIC:: 8517620000
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: China
Country of Diffusion:: Taiwan

The country is subject to change at the time of shipment.

AIROC™ BLUETOOTH® & BLUETOOTH LE Modules

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE Modules assist users in developing Internet of Things (IoT) design quickly and efficiently. These modules greatly reduce development risk and accelerate time to market. Additionally, the modules are qualified by Bluetooth SIG and have received regulatory certification approval from organizations like FCC, ISED, MIC, and CE. This allows users to focus on creating unique IoT applications without worrying about the complexities of board bring-up, RF/spec testing, performance testing, and regulatory testing.