3mm Board-to-Board Interconnects

Amphenol SV Microwave 3mm Board-to-Board Interconnects feature 3mm board-to-board spacing with a 0.150" minimum pitch between adjacent connectors. These connectors offer a DC to 40GHz frequency range and provide low stacked heights. The Amphenol SV Microwave 3mm Board-to-Board Interconnects are ideal for use in embedded computing, high-density stacked PCB applications, and high-density multiport applications.