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2376823-1

Name: TE Connectivity 2376823-1
Brand: TE Connectivity
SKU: 571-2376823-1
Price: 16.2 CAD
Availability: OutOfStock

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Mouser #:

571-2376823-1

Mfr. #:

2376823-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets LGA7529 SOCKET COVER

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2376823-1 Datasheet

ECAD Model:

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More Information

Learn more about TE Connectivity 2376823-1

Availability

Stock:: Non-Stocked

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Factory Lead-Time:: 15 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 3600 Multiples: 3600

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

This Product Ships FREE

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$16.20	$58,320.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Accessories
Series:	LGA7529
Packaging:	Tray
Accessory Type:	Dust Cover
Brand:	TE Connectivity
Housing Material:	Polycarbonate (PC)
Product Type:	IC & Component Sockets
Factory Pack Quantity:	24
Subcategory:	IC & Component Sockets

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Datasheet

2376823-1 Datasheet

Compliance Codes

USHTS:: 8473302000
TARIC:: 8536901000
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

LGA7529 Socket & Hardware

TE Connectivity's (TE) LGA7529 Socket and Hardware include a socket for next-generation server processors, providing more connections between the motherboard and the processor. This socket features 7529 pins, delivering increased performance and data bandwidth to support top processor multi-core architecture and high-throughput workloads. Reliable and easy installation is provided by these products, which are qualified and tested for durability and environmental resistance, including vibration and shock. LGA7529 hardware includes back plates, bolster plates, carriers, and socket covers. TE LGA7529 Socket and Hardware are suitable for networking equipment, Cloud service, servers, switches, edge computing, hyperscale, and artificial intelligence (AI).