10131287-40HSHLF

Amphenol FCI
649-10131287-40HSHLF
10131287-40HSHLF

Mfr.:

Description:
FFC & FPC Connectors 0.3mm pitch in-line 40P HS Flex Conn

Lifecycle:
Factory Special Order:
Obtain a quote to verify the current price, lead-time and ordering requirements of the manufacturer.
ECAD Model:
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In Stock: 18

Stock:
18 Can Ship Immediately
Quantities greater than 18 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 5000)

Pricing (CAD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
$8.22 $8.22
$7.47 $74.70
Full Reel (Order in multiples of 5000)
25 Quote
† $8.50 MouseReel™ fee will be added and calculated in your shopping cart. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Amphenol
Product Category: FFC & FPC Connectors
RoHS:  
Connectors
40 Position
0.3 mm
SMD/SMT
Right Angle
Bottom Contact
Gold
300 mA
FPC
- 55 C
+ 85 C
Reel
Cut Tape
MouseReel
Actuation Type: ZIF
Brand: Amphenol FCI
Contact Material: Copper Alloy
Flammability Rating: UL 94 V-0
Housing Color: Black
Housing Material: Thermoplastic (TP)
Insulation Resistance: 100 MOhms
Product Type: FFC & FPC Connectors
Factory Pack Quantity: 5000
Subcategory: FFC & FPC Connectors
Voltage Rating: 30 V
Unit Weight: 520.182 mg
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CAHTS:
8536690090
CNHTS:
8536901100
USHTS:
8536694051
JPHTS:
853669000
KRHTS:
8536699000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

High-Speed FPC Connectors

Amphenol FCI High-Speed FPC (Flexible Printed Circuit) Connectors transfer data rates up to 10Gbps. This High-Speed FPC Connector features a 0.3mm pitch, in-line layout, and backflip actuator coupled with a locking feature for strong FPC retention. The components comply with USB 3.1/3.0, PCIe 3.0, SATA 3.0, Displayport, and MIPI M-Phy standards. Amphenol's low-profile and compact solution maintains high-speed signal integrity. Applications include tablets, notebooks, high-definition displays, and devices with intermodular board-To-board connections demanding high data rate transmissions.