LMG2652RFBR

Texas Instruments
595-LMG2652RFBR
LMG2652RFBR

Mfr.:

Description:
Gate Drivers

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Texas Instruments LMG2652RFBR

In Stock: 1,368

Stock:
1,368 Can Ship Immediately
Factory Lead-Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (CAD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$20.66 $20.66
$16.80 $168.00
$16.03 $400.75
$13.90 $1,390.00
$13.28 $3,320.00
$12.12 $6,060.00
$11.83 $11,830.00
Full Reel (Order in multiples of 2000)
$10.04 $20,080.00
† $8.50 MouseReel™ fee will be added and calculated in your shopping cart. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Gate Drivers
RoHS:  
GaN FETs
Half-Bridge
SMD/SMT
VQFN-19
1 Driver
1 Output
10 V
26 V
Non-Inverting
30 ns
23 ns
- 40 C
+ 125 C
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Development Kit: LMG2652EVM-101
Input Voltage - Max: 26 V
Input Voltage - Min: 10 V
Maximum Turn-Off Delay Time: 55 ns
Maximum Turn-On Delay Time: 45 ns
Moisture Sensitive: Yes
Operating Supply Current: 6.1 A
Product Type: Gate Drivers
Rds On - Drain-Source Resistance: 140 mOhms
Shutdown: No Shutdown
Factory Pack Quantity: 2000
Subcategory: PMIC - Power Management ICs
Technology: GaN
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Attributes selected: 0

Datasheet

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USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

LMG2652 650V 140mΩ GaN Power-FET Half Bridge

Texas Instruments LMG2652 650V 140mΩ GaN Power-FET Half-Bridge simplifies design, reduces component count, and reduces board space. This simplification is done by integrating half-bridge power FETs, gate drivers, bootstrap diode, and high-side gate-drive level shifter in a 6mm by 8mm QFN package. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor. It allows the low-side thermal pad to be connected to the cooling PCB power ground.

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