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BMD-330-A-R

Name: u-blox BMD-330-A-R
Brand: u-blox
SKU: 377-BMD-330-A-R
Price: 5.84 CAD
Availability: InStock

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Mouser #:

377-BMD-330-A-R

Mfr. #:

BMD-330-A-R

Mfr.:

u-blox

Description:

Bluetooth Modules - 802.15.1 BMD-330-A-R

Datasheet:

BMD-330-A-R Datasheet (PDF)

ECAD Model:

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More Information

Learn more about u-blox BMD-330-A-R

In Stock: 5,878

Stock:: 5,878 Can Ship Immediately

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Factory Lead-Time:: 12 Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$5.84	$5.84
	$5.50	$55.00
Full Reel (Order in multiples of 1000)
	$5.50	$5,500.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	u-blox
Product Category:	Bluetooth Modules - 802.15.1
RoHS:
Series:	BMD-330
Protocol:	BLE, Bluetooth 5.0
Interface Type:	I2C, SPI, UART
Output Power:	4 dBm
Data Rate:	2 Mb/s
Receiver Sensitivity:	- 96 dBm
Frequency:	2.4 GHz
Supply Voltage - Min:	1.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Reel
Packaging:	Cut Tape
Antenna:	Integrated
Brand:	u-blox
Height:	1.9 mm
Length:	14 mm
Modulation Technique:	GFSK
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	1.7 V to 3.6 V
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth LE
Sensitivity:	- 96 dBm
Factory Pack Quantity:	1000
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	11.2 mA
Supply Current Transmitting:	10.1 mA, 15.4 mA
Width:	9.8 mm

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Datasheet

BMD-330-A-R Datasheet (PDF)

Models

BMD-330-A-R Symbol & Footprint by SnapMagic

CNHTS:: 8517629990
USHTS:: 8517620090
JPHTS:: 851762090
TARIC:: 8517620000
MXHTS:: 8473300499
ECCN:: 5A992.C

BMD-330 Modules for Bluetooth 5 LE

u-blox BMD-330 Modules for Bluetooth 5 LE are based on the nRF52810 SoC from Nordic Semiconductor and feature an ARM® Cortex™ M4 CPU, embedded 2.4GHz transceiver, and integrated antenna. The BMD-330 modules provide a complete RF solution with no additional RF design. The modules can power demanding applications while simplifying designs and reducing BOM costs for faster time to market.