Tflex SF7 Thermal Gap Fillers
Laird Technologies Tflex SF7 Thermal Gap Fillers are innovative, high-performing thermal materials with silicone-free construction. The silicone-free design supplies products with excellent deflection properties, providing minimal pressure on components during deflection. A minimum amount of pressure is required to reach the lowest possible thermal resistance. These fillers offer a 0.5mm to 4mm thickness range, 7.8W/mK thermal conductivity, and 5 x 10^13 volume resistivity. Laird Technologies Tflex SF7 Thermal Gap Fillers are ideal for datacom systems, optical modules, cameras, and automotive electronics.
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