EV_MOD_ICU-20201-01

TDK InvenSense
410-EV_MODICU2020101
EV_MOD_ICU-20201-01

Mfr.:

Description:
Distance Sensor Development Tool ICU-20201

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
18
Expected 2026-02-12
Factory Lead-Time:
3
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (CAD)

Qty. Unit Price
Ext. Price
$30.57 $30.57

Product Attribute Attribute Value Select Attribute
TDK
Product Category: Distance Sensor Development Tool
Distance Sensor Development Tool
Evaluation Module
Ultrasonic Sensor
1.8 V
ICU-20201
Brand: TDK InvenSense
Interface Type: SPI
Factory Pack Quantity: 1
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Attributes selected: 0

CAHTS:
8543700000
CNHTS:
8543709990
USHTS:
8543709860
JPHTS:
854370000
ECCN:
EAR99

EV_MOD_ICU-20201-01 Evaluation Module

TDK InvenSense EV_MOD_ICU-20201-01 Evaluation Module is designed to evaluate the ICU-20201 ultrasonic sensor with a 45° Field-of-View (FoV). The ICU-20201 Time-of-Flight (ToF) range sensor is a miniature, ultra-low power, and long-range ultrasonic sensor based on Chirp's patented MEMS technology. This sensor also features multi-object detection, a single sound port for receiving and transmitting, flexible 1.71V to 3.63V I/O voltage, and a 13MHz SPI interface. The ICU-20201 sensor is used in smart door lock wake-on-approach, wall following, obstacle avoidance, parking lot sensors for vehicle counting, and ground-level measurement in drones.