QspiNAND Flash Memory

Winbond QspiNAND Flash Memory is high-performance, low-power memory built with Single-Level Cell (SLC) memory technology and implementing 1-bit Error Correction Code (ECC) on all read and write operations. The integrated ECC detects and corrects errors and enables contiguous good memory (bad block management). This feature offloads these functions from an external controller. The QspiNAND Flash Memory also supports Executive-in-Place (XiP) functionality, in which an SoC or processor executes application code directly from the external flash memory without shadowing it to DRAM.

Results: 3
Select Image Part # Mfr. Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Mounting Style Package / Case Series Memory Size Interface Type Organization Timing Type Data Bus Width Supply Voltage - Min Supply Voltage - Max Supply Current - Max Minimum Operating Temperature Maximum Operating Temperature Packaging
Winbond NAND Flash 1G-bit Serial NAND flash, 3V 465In Stock
Min.: 1
Mult.: 1
Max.: 465

SMD/SMT TFBGA-24 W25N01GV 1 Gbit SPI 128 M x 8 Asynchronous 8 bit 2.7 V 3.6 V 35 mA - 40 C + 85 C Tray
Winbond NAND Flash 512Mb Serial NAND flash, 3V 3,466In Stock
Min.: 1
Mult.: 1
Max.: 3,465

SMD/SMT WSON-8 W25N512GV 512 Mbit SPI 64 M x 8 Asynchronous 8 bit 2.7 V 3.6 V 35 mA - 40 C + 85 C Tube
Winbond NAND Flash 1G-bit Serial NAND flash, 1.8V 106In Stock
Min.: 1
Mult.: 1
Max.: 44

SMD/SMT SOIC-16 W25N01JW 1 Gbit SPI 128 M x 8 Asynchronous 8 bit 1.7 V 1.95 V 35 mA - 40 C + 85 C Tube