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2310026

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See Product Specifications

Mouser #:

298-2310026

Mfr. #:

2310026

Mfr.:

Loctite

Description:

Chemicals Underfill, 55CC Plastic Syringe, LOCTITE Eccobond UF 3812 Series

This product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.

Datasheet:

2310026 Datasheet (PDF)

More Information

Learn more about Loctite 2310026

Shipping Alert:

Mouser does not presently sell this product in your region.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Loctite
Product Category:	Chemicals
Shipping Restrictions:	Mouser does not presently sell this product in your region.
RoHS:
Product:	Epoxy Compounds
Type:	Loctite ECCOBOND UF 3812
Brand:	Loctite
Contains Lead:	No
Description/Function:	Reworkable epoxy underfill is designed for CSP, WLCSP and BGA application
Package Type:	Syringe
Packaging:	Cartridge
Product Type:	Chemicals
Series:	UF 3812
Factory Pack Quantity:	15
Subcategory:	Supplies
Tradename:	Eccobond
Unit Weight:	55 g

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Filter Document:

Datasheet

2310026 Datasheet (PDF)

MSDS

Safety Data Sheet (PDF)

USHTS:: 3907300000
ECCN:: EAR99

Server Applications

Loctite Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Loctite offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Data Center Applications

Loctite Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Loctite designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Loctite Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Loctite help components properly function for optimal operation.

Industrial Automation

Loctite Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

5G Products

LOCTITE 5G Products ensure reliable, long-term performance. The highly-stable interconnect materials provide fundamental electrical function for dependable telecom infrastructure performance. Due to the demanding conditions required for 5G telecom infrastructure components, multiple formats are provided, including pads, gels, liquids and adhesives to maximize system reliability.

ECCOBOND UF 3812

Loctite ECCOBOND UF 3812 is a reworkable epoxy underfill designed for CSP, WLCSP, and BGA applications. The low viscosity of the material ensures it flows at room temperature with no additional preheating required, while the high Tg and high fracture toughness enable the protection of the solder joints during thermal cycling. Additionally, this epoxy underfill is halogen-free, compatible with most lead-free solders, and offers stable electric performance under thermal/humidity bias. Loctite ECCOBOND UF 3812 cures quickly at moderate temperatures, minimizing stress to other components.