900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Results: 145
Select Image Part # Mfr. Description Datasheet Availability Pricing (CAD) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Designed for Mounting Style Heatsink Material Fin Style Thermal Resistance Length Width Height
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 11.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 14.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 17.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 20.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 22.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 33.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 33mm Chip Size, 32.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 33mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 11.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 14.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 17.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 20.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 22.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 35.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 32.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Omnidirectional Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 14.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 20.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 35.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 32.6mm Height, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 35mm Clip Aluminum Pin Fin
Wakefield Thermal Heat Sinks Chipset Heat Sink wClip, Pin Fin, 35mm Chip Size, 22.6mm (H), 0.9-2.1mm Chip (H) Non-Stocked
Min.: 1
Mult.: 1

Heat Sinks BGA Press Fit Aluminum Pin Fin 8.75 C/W 22.6 mm
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 11.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 14.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 17.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 20.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 22.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum
Wakefield Thermal Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 27.6mm H, Aluminum Non-Stocked Lead-Time 16 Weeks
Min.: 300
Mult.: 300

Heat Sink Assemblies Component, 37mm Clip Aluminum