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TD60N16SOF

Name: Infineon TD60N16SOF
Brand: Infineon Technologies
SKU: 641-TD60N16SOF
Price: 47 CAD
Availability: InStock

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Mouser #:

641-TD60N16SOF

Mfr. #:

TD60N16SOF

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules 20mm Solder Bond Thyristor/Diode

Datasheet:

TD60N16SOF Datasheet (PDF)

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More Information

Learn more about Infineon Technologies TD60N16SOF

In Stock: 5

Stock:: 5 Can Ship Immediately

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Factory Lead-Time:: 30 Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$47.00	$47.00
	$39.28	$471.36
	$34.34	$3,708.72

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Product:	Thyristor-Diode Modules
Type:	Thyristor / Diode
Technology:	Si
Mounting Style:	Screw Mount
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Gate Trigger Current - Igt:	100 mA
Holding Current Ih Max:	250 mA
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	12
Subcategory:	Discrete and Power Modules
Part # Aliases:	SP001272784 TD60N16SOFHPSA1
Unit Weight:	75 g

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Datasheet

TD60N16SOF Datasheet (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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CAHTS:: 8541300000
CNHTS:: 8504409100
USHTS:: 8541300080
JPHTS:: 854130000
KRHTS:: 8541109000
TARIC:: 8541300000
MXHTS:: 8541100101
ECCN:: EAR99

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.