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EBTF-4-08-2.0-S-RA-1-R

Name: Samtec EBTF-4-08-2.0-S-RA-1-R
Brand: Samtec
SKU: 200-EBTF-4082.0SRA1R
Price: 36.77 CAD
Availability: InStock

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Mouser #:

200-EBTF-4082.0SRA1R

Mfr. #:

EBTF-4-08-2.0-S-RA-1-R

Mfr.:

Samtec

Description:

High Speed / Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Right-Angle Receptacle

Datasheet:

EBTF-4-08-2.0-S-RA-1-R Datasheet (PDF)

ECAD Model:

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Learn more about Samtec EBTF-4-08-2.0-S-RA-1-R

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$36.77	$36.77
	$33.60	$336.00
	$28.06	$1,683.60
	$25.45	$2,545.00
	$23.41	$6,086.60
	$21.53	$10,765.00
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed / Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	64 Position
Number of Rows:	8 Row
Pitch:	2 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	EBTF
Packaging:	Tray
Brand:	Samtec
Contact Material:	Copper Alloy
Current Rating:	4.2 A
Housing Color:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	20
Subcategory:	Backplane Connectors
Tradename:	ExaMAX

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Specification Sheets

Technical Resources

Test Report (PDF)

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.