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APM6-060-01.5-L-04-2-A-TR

Name: Samtec APM6-060-01.5-L-04-2-A-TR
Brand: Samtec
SKU: 200-APM6060015L42ATR
Price: 49.09 CAD
Availability: InStock

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Mouser #:

200-APM6060015L42ATR

Mfr. #:

APM6-060-01.5-L-04-2-A-TR

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal

Datasheet:

APM6-060-01.5-L-04-2-A-TR Datasheet (PDF)

ECAD Model:

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Learn more about Samtec APM6-060-01.5-L-04-2-A-TR

In Stock: 87

Stock:: 87 Can Ship Immediately

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Factory Lead-Time:: 1 Week Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$49.09	$49.09
	$41.73	$417.30
	$39.12	$978.00
	$37.26	$1,863.00
	$35.48	$3,548.00
	$34.22	$8,555.00
Full Reel (Order in multiples of 475)
	$31.68	$15,048.00
950	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Headers
Number of Positions:	240 Position
Pitch:	0.635 mm (0.025 in)
Number of Rows:	4 Row
Termination Style:	Solder Balls
Mounting Angle:	Straight
Stack Height:	5 mm
Current Rating:	1.34 A
Voltage Rating:	155 VAC
Maximum Data Rate:	56 Gbps
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	APM6
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Samtec
Data Rate:	56 Gbps
Mounting Style:	SMD/SMT
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	475
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	Accelerate HP

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Datasheet

APM6-060-01.5-L-04-2-A-TR Datasheet (PDF)

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Specification Sheets

Technical Resources

Test Report (PDF)

Conflict Material Declaration (Spreadsheet)

CAHTS:: 8536690020
CNHTS:: 8536901100
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay^® Extreme Performance (EP) and AcceleRate^® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

APF6 & APM6 AcceleRate® High-Performance Arrays

Samtec APF6 and APM6 AcceleRate^® High-Performance Arrays are 0.635mm pitch interconnects featuring 112Gbps PAM4 extreme performance and a flexible open-pin-field design. The arrays feature a high-density, four-row design with 10 to 100 positions in each row and offer a roadmap to 1000 or more pins. These connectors are ideal for space-constrained applications, with a low-profile 5mm height and a slim 5mm width. Samtec APF6 and APM6 AcceleRate High-Performance Terminals support 112Gbps PAM4 (56Gbps NRZ) applications and are PCIe^® 6.0/CXL^® 3.2 and 100GbE compatible.