211888-0001

Name: Molex 211888-0001
Brand: Molex
SKU: 538-211888-0001
Price: 5.69 CAD
Availability: InStock

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Mouser #:

538-211888-0001

Mfr. #:

211888-0001

Mfr.:

Molex

Description:

Heavy Duty Power Connectors PowerWize HC 6mm TERM RET. HSG 6AWG

Datasheet:

211888-0001 Datasheet

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In Stock: 320

Stock:: 320 Can Ship Immediately

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Factory Lead-Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$5.69	$5.69
	$5.18	$51.80
	$4.91	$122.75
	$4.79	$239.50
	$4.56	$364.80
	$4.00	$960.00
	$3.88	$2,172.80
	$3.30	$3,432.00
	$3.08	$7,884.80

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Heavy Duty Power Connectors
RoHS:
Series:	211888
Product:	Accessories
Accessory Type:	TPA Retainer
Number of Positions:	1 Position
Housing Material:	PBT
Wire Gauge Max:	6 AWG
Packaging:	Bulk
Tradename:	PowerWize
Brand:	Molex
Flammability Rating:	UL 94 V-0
For Use With:	Contacts
Housing Color:	Black
Maximum Operating Temperature:	+ 105 C
Minimum Operating Temperature:	- 40 C
Mounting Angle:	Straight
Product Type:	Heavy Duty Power Connectors
Factory Pack Quantity:	80
Subcategory:	Power Connectors
Part # Aliases:	2118880001 02118880001
Unit Weight:	2.874 g

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Filter Document:

USHTS:: 8538906000
TARIC:: 8547200090
ECCN:: EAR99

PowerWize High-Current Interconnect System

Molex PowerWize High-Current Interconnect System is a high-current wire-to-board / wire-to-busbar interconnect system that allows engineers to deliver power throughout their designs. The two-circuit headers and receptacle housings are available in two sizes: 6mm (rated up to 120A) and 8mm (rated up to 175A). Mechanically keyed, color-coded versions are available for applications that require multiple headers on the same board. Color-coding ensures that cable assemblies are not mismated during system integration. The screw-mount headers can attach to either PCBs or busbars. Molex PowerWize applications include industrial automation, alternative energy, data centers, test and measurement, and telecommunication.