560-005-000-210

EDAC
587-560-005-000-210
560-005-000-210

Mfr.:

Description:
Pin & Socket Connectors 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 5 contact spaces, female, white, Wire Insulation oe1.00 to oe1.30

ECAD Model:
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In Stock: 239

Stock:
239 Can Ship Immediately
Factory Lead-Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (CAD)

Qty. Unit Price
Ext. Price
$1.44 $1.44
$1.23 $12.30
$1.15 $28.75
$1.10 $110.00
$0.99 $247.50
$0.901 $450.50
$0.801 $801.00
$0.725 $1,812.50
$0.701 $3,505.00

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Pin & Socket Connectors
RoHS:  
Receptacle Housings
5 Position
1 Row
2.5 mm
Crimp
Free Hanging
Polybutylene Terephthalate (PBT)
250 V
560
Brand: EDAC
Contact Type: Pin, Socket
Flammability Rating: UL 94 V-0
Housing Color: White
Housing Gender: Receptacle
Mounting Angle: Straight
Product Type: Pin & Socket Connectors
Factory Pack Quantity: 500
Subcategory: Pin & Socket Connectors
Unit Weight: 2.100 g
Products found:
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Attributes selected: 0

CAHTS:
8536690040
CNHTS:
8538900000
USHTS:
8538908180
JPHTS:
853890000
KRHTS:
8536699000
TARIC:
8536699099
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

E-Seal Waterproof Connectors

EDAC E-Seal Waterproof Connectors use a unique epoxy sealing process that seals the entire back of the connector rather than at the individual pins. This produces a complete seal with a smooth finish and guarantees no water ingress up to IP67 standards. The E-Seal system offers a full range of D-subs from DB 9 to a maximum of 78 positions. Standard and high-density footprints are available in vertical or right angle orientations. EDAC E-Seal Waterproof Connectors plating options vary from gold flash to 30u” of gold and include a wide variety of mounting options.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.