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10163478-14373T1LF

Name: Amphenol 10163478-14373T1LF
Brand: Amphenol FCI
SKU: 523-1016347814373T1L
Price: 62.33 CAD
Availability: InStock

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Mouser #:

523-1016347814373T1L

Mfr. #:

10163478-14373T1LF

Mfr.:

Amphenol FCI

Description:

Board to Board & Mezzanine Connectors .635M 400P REC

Datasheet:

10163478-14373T1LF Datasheet (PDF)

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Learn more about Amphenol FCI 10163478-14373T1LF

In Stock: 10

Stock:: 10

Can Ship Immediately

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On Order:: 300

Expected 2026-03-23
Factory Lead-Time:: 15

Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$62.33	$62.33
	$52.98	$529.80
	$51.00	$1,275.00
500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Receptacles
Number of Positions:	400 Position
Pitch:	0.635 mm (0.025 in)
Number of Rows:	4 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	3.73 mm
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Thermoplastic (TP)
Series:	COM-HPC
Packaging:	Tray
Brand:	Amphenol FCI
Mounting Style:	PCB Mount
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	1400
Subcategory:	Board to Board & Mezzanine Connectors

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Filter Document:

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

COM-HPC Board-to-Board Connectors

Amphenol FCI COM-HPC Board-to-Board Connectors feature a pair of 0.635mm pitch connectors with 400 pin positions. The connectors provide plug and receptacle assemblies that support 5mm and 10mm stack heights. The COM-HPC series addresses performance demands and increased bandwidth needs in server applications. The connectors deliver up to PCIe Gen5 32Gb/s SI performance and can handle Intel^® Core processors. The connectors can store one terabyte of memory via eight DIMM sockets. Amphenol FCI COM-HPC Board-to-Board Connectors support a 150W max CPU power and are ideal for datacom, 5G wireless infrastructure, industrial embedded computing, medical, and military applications.