It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

ATS012012012-SF-2K

Name: Advanced Thermal Solutions ATS012012012-SF-2K
Brand: Advanced Thermal Solutions
SKU: 984-ATS012012012SF2K
Price: 6.39 CAD
Availability: InStock

Images are for reference only
See Product Specifications

Mouser #:

984-ATS012012012SF2K

Mfr. #:

ATS012012012-SF-2K

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 12x12x12mm

Datasheet:

ATS012012012-SF-2K Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS012012012-SF-2K

In Stock: 32

Stock:: 32 Can Ship Immediately

An unexpected error occurred. Please try again later.
Factory Lead-Time:: 19 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$6.39	$6.39
	$5.64	$56.40
	$5.38	$107.60
	$5.01	$250.50
	$4.82	$482.00
	$4.59	$918.00
	$4.48	$2,240.00
	$4.31	$4,310.00
	$4.23	$8,460.00

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	19.49 C/W
Length:	12 mm
Width:	12 mm
Height:	12 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

ATS012012012-SF-2K Datasheet (PDF)

This functionality requires JavaScript to be enabled.

CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.