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ATS-59005-C1-R0

Name: Advanced Thermal Solutions ATS-59005-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59005-C1-R0
Price: 34.13 CAD
Availability: InStock

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Mouser #:

984-ATS-59005-C1-R0

Mfr. #:

ATS-59005-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 29mm, No PED, 29x37x10mm

Datasheet:

ATS-59005-C1-R0 Datasheet (PDF)

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$34.13	$3,413.00
	$33.43	$6,686.00
	$33.22	$16,610.00
1,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Thermal Resistance:	6.2 C/W
Length:	37 mm
Width:	29 mm
Height:	10 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP
Type:	Component

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Datasheet

ATS-59005-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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CNHTS:: 7616991090
USHTS:: 7616995190
TARIC:: 7616991099
MXHTS:: 7616995195
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.