ATS-59001-C1-R0

Advanced Thermal Solutions
984-ATS-59001-C1-R0
ATS-59001-C1-R0

Mfr.:

Description:
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 21mm Comp, 28x45x11mm

Datasheet:
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Availability

Stock:
100 Can Ship in 20 Days
Minimum: 100   Multiples: 100
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (CAD)

Qty. Unit Price
Ext. Price
$49.21 $4,921.00
$47.97 $9,594.00
500 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
4.5 C/W
45 mm
21 mm
11 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
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Attributes selected: 0

Datasheet

Test/Quality Data

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink. 

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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