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ATS-52250G-C1-R0

Name: Advanced Thermal Solutions ATS-52250G-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-52250G-C1-R0
Price: 15.05 CAD
Availability: InStock

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Mouser #:

984-ATS-52250G-C1-R0

Mfr. #:

ATS-52250G-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiFLOW BGA Heat Sink, Double-Side Thermal Tape, T412, 25mm L, 25mm W, 12.5mm H

Datasheet:

ATS-52250G-C1-R0 Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS-52250G-C1-R0

In Stock: 176

Stock:: 176 Can Ship Immediately

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Factory Lead-Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$15.05	$15.05
	$13.33	$133.30
	$12.69	$253.80
	$12.28	$614.00
	$12.26	$1,226.00
	$12.21	$12,210.00
2,000	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	Thermal Tape, Adhesive (Included)
Heatsink Material:	Aluminum
Fin Style:	Square Fin
Thermal Resistance:	5.20 deg C/W
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Height:	0.492" (12.50mm)
Brand:	Advanced Thermal Solutions
Color:	Blue
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	HS with TAPE
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW
Type:	Top Mount
Part # Aliases:	ATS-50230G-C2-HS
Unit Weight:	7.100 g

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CNHTS:: 8473309000
USHTS:: 8542900000
TARIC:: 7616991099
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.