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XC7S25-2CSGA225C

Name: AMD XC7S25-2CSGA225C
Brand: AMD / Xilinx
SKU: 217-XC7S25-2CSGA225C
Price: 70.31 CAD
Availability: OutOfStock

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Mouser #:

217-XC7S25-2CSGA225C

Mfr. #:

XC7S25-2CSGA225C

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XC7S25-2CSGA225C

Datasheet:

XC7S25-2CSGA225C Datasheet (PDF)

ECAD Model:

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Learn more about AMD / Xilinx XC7S25-2CSGA225C

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On Order:: 62

Expected 2026-02-19
Factory Lead-Time:: 31

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

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Pricing (CAD)

Qty.	Unit Price	Ext. Price
	$70.31	$70.31

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
RoHS:
Series:	XC7S25
Number of Logic Elements:	23360 LE
Adaptive Logic Modules - ALMs:	3650 ALM
Embedded Memory:	1.58 Mbit
Number of I/Os:	150 I/O
Supply Voltage - Min:	950 mV
Supply Voltage - Max:	1.05 V
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package / Case:	CSBGA-225
Brand:	AMD / Xilinx
Distributed RAM:	313 kbit
Embedded Block RAM - EBR:	1620 kbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	1825 LAB
Operating Supply Voltage:	1 V
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	160
Subcategory:	Programmable Logic ICs
Tradename:	Spartan
Unit Weight:	21.177 g

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Datasheet

XC7S25-2CSGA225C Datasheet (PDF)

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CNHTS:: 8542399000
USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: EAR99

Spartan™ 7 FPGAs

AMD / Xilinx Spartan™ 7 FPGAs feature a MicroBlaze™ soft processor running over 200DMIPs with 800Mb/s DDR3 support built on 28nm technology. The Spartan-7 offers integrated analog-to-digital converters, dedicated security features, and Q-grade (-40°C to +125°C) on all commercial devices. Spartan-7 devices enable essential connectivity and processing applications in industrial, automotive, consumer, and communications markets. The Spartan™ 7 FPGAs address system requirements ranging from small form factor, cost-sensitive, and high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal-processing capability.